Gordon N. Ellison
About
Gordon N. Ellison has authored 13 papers that have received a total of 223 indexed citations.
This includes 7 papers in Mechanical Engineering, 5 papers in Electrical and Electronic Engineering and 3 papers in Mechanics of Materials. The topics of these papers are Heat Transfer and Optimization (7 papers), Electronic Packaging and Soldering Technologies (4 papers) and 3D IC and TSV technologies (3 papers). Gordon N. Ellison is often cited by papers focused on Heat Transfer and Optimization (7 papers), Electronic Packaging and Soldering Technologies (4 papers) and 3D IC and TSV technologies (3 papers) and collaborates with scholars based in United States, Australia and United Kingdom. Gordon N. Ellison's co-authors include B.R. Stanmore and Ian P. Thompson and has published in prestigious journals such as Journal of The Electrochemical Society, IEEE Transactions on Electron Devices and Fuel Processing Technology
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