Griselda Bonilla
About
Griselda Bonilla has authored 34 papers that have received a total of 464 indexed citations.
This includes 30 papers in Electronic, Optical and Magnetic Materials, 26 papers in Electrical and Electronic Engineering and 9 papers in Materials Chemistry. The topics of these papers are Copper Interconnects and Reliability (24 papers), Semiconductor materials and devices (21 papers) and Electronic Packaging and Soldering Technologies (8 papers). Griselda Bonilla is often cited by papers focused on Copper Interconnects and Reliability (24 papers), Semiconductor materials and devices (21 papers) and Electronic Packaging and Soldering Technologies (8 papers) and collaborates with scholars based in United States, Puerto Rico and Germany. Griselda Bonilla's co-authors include T. M. Shaw, R. N. P. Choudhary, Dillip K. Pradhan, Ram S. Katiyar and T. Spooner and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Journal of The Electrochemical Society
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