Guanglan Liao
About
Guanglan Liao has authored 192 papers that have received a total of 5.0k indexed citations.
This includes 121 papers in Electrical and Electronic Engineering, 51 papers in Materials Chemistry and 38 papers in Biomedical Engineering. The topics of these papers are Perovskite Materials and Applications (42 papers), Electronic Packaging and Soldering Technologies (27 papers) and 3D IC and TSV technologies (21 papers). Guanglan Liao is often cited by papers focused on Perovskite Materials and Applications (42 papers), Electronic Packaging and Soldering Technologies (27 papers) and 3D IC and TSV technologies (21 papers) and collaborates with scholars based in China, United States and Hong Kong. Guanglan Liao's co-authors include Zirong Tang, Tielin Shi, Tielin Shi, Bo Sun and Xingyue Liu and has published in prestigious journals such as Nano Letters, ACS Nano and Energy & Environmental Science
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