Guojun Hu
About
Guojun Hu has authored 19 papers that have received a total of 175 indexed citations.
This includes 7 papers in Mechanical Engineering, 6 papers in Electrical and Electronic Engineering and 6 papers in Mechanics of Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (6 papers), 3D IC and TSV technologies (3 papers) and biodegradable polymer synthesis and properties (3 papers). Guojun Hu is often cited by papers focused on Electronic Packaging and Soldering Technologies (6 papers), 3D IC and TSV technologies (3 papers) and biodegradable polymer synthesis and properties (3 papers) and collaborates with scholars based in China, Singapore and Iran. Guojun Hu's co-authors include Jing-en Luan, Hong Gao, Demin Jia, Lan Liu and Yuanfang Luo and has published in prestigious journals such as Chemical Communications, Composites Science and Technology and Journal of Organometallic Chemistry
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