H. Balkan
About
H. Balkan has authored 8 papers that have received a total of 362 indexed citations.
This includes 6 papers in Electrical and Electronic Engineering, 4 papers in Mechanical Engineering and 1 paper in Mechanics of Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (6 papers), 3D IC and TSV technologies (4 papers) and Electrical Contact Performance and Analysis (2 papers). H. Balkan is often cited by papers focused on Electronic Packaging and Soldering Technologies (6 papers), 3D IC and TSV technologies (4 papers) and Electrical Contact Performance and Analysis (2 papers) and collaborates with scholars based in United States, Singapore and Italy. H. Balkan's co-authors include Henry Y. Lu, P. Elenius, Erdogan Madenci, K. Y. Simon Ng and Ke Zeng and has published in prestigious journals such as Applied Physics Letters, International Journal of Solids and Structures and Journal of materials research/Pratt's guide to venture capital sources
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