H. Berg

23 papers and 333 indexed citations i.

H. Berg has authored 23 papers that have received a total of 333 indexed citations. This includes 19 papers in Electrical and Electronic Engineering, 7 papers in Biomedical Engineering and 5 papers in Mechanical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (13 papers), 3D IC and TSV technologies (6 papers) and Metallurgical and Alloy Processes (4 papers). H. Berg is often cited by papers focused on Electronic Packaging and Soldering Technologies (13 papers), 3D IC and TSV technologies (6 papers) and Metallurgical and Alloy Processes (4 papers) and collaborates with scholars based in United States. H. Berg's co-authors include Gary L. Lewis, J. B. Cohen, C. A. Mitchell, J. Jay Liu and W. M. Paulson and has published in prestigious journals such as IEEE Transactions on Electron Devices, Materials Chemistry and Physics and Journal of Electronic Materials