H. Ceric

58 papers and 484 indexed citations i.

H. Ceric has authored 58 papers that have received a total of 484 indexed citations. This includes 53 papers in Electrical and Electronic Engineering, 34 papers in Electronic, Optical and Magnetic Materials and 15 papers in Mechanics of Materials. The topics of these papers are Copper Interconnects and Reliability (33 papers), Semiconductor materials and devices (29 papers) and Electronic Packaging and Soldering Technologies (25 papers). H. Ceric is often cited by papers focused on Copper Interconnects and Reliability (33 papers), Semiconductor materials and devices (29 papers) and Electronic Packaging and Soldering Technologies (25 papers) and collaborates with scholars based in Austria, Germany and Belgium. H. Ceric's co-authors include S. Selberherr, Tibor Grasser, Roberto Lacerda de Orio, H. Enichlmair and Stanislav Tyaginov and has published in prestigious journals such as Journal of Applied Physics, IEEE Transactions on Electron Devices and Materials Science and Engineering R Reports