H. F. Webster

19 papers and 330 indexed citations i.

H. F. Webster has authored 19 papers that have received a total of 330 indexed citations. This includes 8 papers in Electrical and Electronic Engineering, 7 papers in Materials Chemistry and 4 papers in Biomedical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (4 papers), 3D IC and TSV technologies (3 papers) and Atom Probe Tomography Research (3 papers). H. F. Webster is often cited by papers focused on Electronic Packaging and Soldering Technologies (4 papers), 3D IC and TSV technologies (3 papers) and Atom Probe Tomography Research (3 papers) and collaborates with scholars based in United States. H. F. Webster's co-authors include J. P. Wightman, R. O. Carlson, C. A. Neugebauer, J. R. Thompson and J. Godward and has published in prestigious journals such as Journal of Applied Physics, Langmuir and Carbon