H. Frémont

54 papers and 232 indexed citations i.

H. Frémont has authored 54 papers that have received a total of 232 indexed citations. This includes 47 papers in Electrical and Electronic Engineering, 13 papers in Mechanical Engineering and 9 papers in Mechanics of Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (34 papers), 3D IC and TSV technologies (25 papers) and Integrated Circuits and Semiconductor Failure Analysis (10 papers). H. Frémont is often cited by papers focused on Electronic Packaging and Soldering Technologies (34 papers), 3D IC and TSV technologies (25 papers) and Integrated Circuits and Semiconductor Failure Analysis (10 papers) and collaborates with scholars based in France, Germany and Canada. H. Frémont's co-authors include S. Moreau, S. Lhostis, Jean-Yves Delétage, Nathalie Labat and Bernard Plano and has published in prestigious journals such as Sensors, Thin Solid Films and IEEE Transactions on Electron Devices