H. Fujimoto
About
H. Fujimoto has authored 39 papers that have received a total of 514 indexed citations.
This includes 20 papers in Electrical and Electronic Engineering, 16 papers in Mechanics of Materials and 12 papers in Electronic, Optical and Magnetic Materials. The topics of these papers are Copper Interconnects and Reliability (12 papers), Metal and Thin Film Mechanics (12 papers) and Electronic Packaging and Soldering Technologies (10 papers). H. Fujimoto is often cited by papers focused on Copper Interconnects and Reliability (12 papers), Metal and Thin Film Mechanics (12 papers) and Electronic Packaging and Soldering Technologies (10 papers) and collaborates with scholars based in United States, Japan and France. H. Fujimoto's co-authors include Qing Ma, Qing Ma, Michael Lane, T. Marieb and Qing Ma and has published in prestigious journals such as Physical Review Letters, Applied Physics Letters and Journal of Applied Physics
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