H. Geisler
About
H. Geisler has authored 44 papers that have received a total of 382 indexed citations.
This includes 22 papers in Electrical and Electronic Engineering, 20 papers in Electronic, Optical and Magnetic Materials and 14 papers in Mechanics of Materials. The topics of these papers are Copper Interconnects and Reliability (17 papers), Metal and Thin Film Mechanics (13 papers) and Electronic Packaging and Soldering Technologies (10 papers). H. Geisler is often cited by papers focused on Copper Interconnects and Reliability (17 papers), Metal and Thin Film Mechanics (13 papers) and Electronic Packaging and Soldering Technologies (10 papers) and collaborates with scholars based in Germany, United States and Canada. H. Geisler's co-authors include Ehrenfried Zschech, K. Samwer, M. Moske, K. O. Schweitz and Alexander Tselev and has published in prestigious journals such as Journal of Applied Physics, Thin Solid Films and Applied Physics A
In The Last Decade
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