H. K. Kim

8 papers and 457 indexed citations i.

H. K. Kim has authored 8 papers that have received a total of 457 indexed citations. This includes 8 papers in Electrical and Electronic Engineering, 7 papers in Mechanical Engineering and 1 paper in Computational Mechanics. The topics of these papers are Electronic Packaging and Soldering Technologies (8 papers), Intermetallics and Advanced Alloy Properties (4 papers) and 3D IC and TSV technologies (4 papers). H. K. Kim is often cited by papers focused on Electronic Packaging and Soldering Technologies (8 papers), Intermetallics and Advanced Alloy Properties (4 papers) and 3D IC and TSV technologies (4 papers) and collaborates with scholars based in United States and Italy. H. K. Kim's co-authors include K. N. Tu, P. A. Totta, K. N. Tu, H. K. Liou and G. Z. Pan and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Journal of materials research/Pratt's guide to venture capital sources