H. Mavoori
About
H. Mavoori has authored 27 papers that have received a total of 1.0k indexed citations.
This includes 14 papers in Electrical and Electronic Engineering, 9 papers in Mechanical Engineering and 8 papers in Materials Chemistry. The topics of these papers are Electronic Packaging and Soldering Technologies (7 papers), 3D IC and TSV technologies (5 papers) and Aluminum Alloys Composites Properties (5 papers). H. Mavoori is often cited by papers focused on Electronic Packaging and Soldering Technologies (7 papers), 3D IC and TSV technologies (5 papers) and Aluminum Alloys Composites Properties (5 papers) and collaborates with scholars based in United States, Germany and Taiwan. H. Mavoori's co-authors include Sungho Jin, R.P. Espindola, L. M. Keer, T.A. Strasser and Shangzhong Jin and has published in prestigious journals such as Nature, Applied Physics Letters and Optics Letters
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