H. Shimamoto
About
H. Shimamoto has authored 47 papers that have received a total of 259 indexed citations.
This includes 46 papers in Electrical and Electronic Engineering, 7 papers in Atomic and Molecular Physics, and Optics and 5 papers in Biomedical Engineering. The topics of these papers are 3D IC and TSV technologies (28 papers), Electronic Packaging and Soldering Technologies (16 papers) and Radio Frequency Integrated Circuit Design (11 papers). H. Shimamoto is often cited by papers focused on 3D IC and TSV technologies (28 papers), Electronic Packaging and Soldering Technologies (16 papers) and Radio Frequency Integrated Circuit Design (11 papers) and collaborates with scholars based in Japan, United Kingdom and Spain. H. Shimamoto's co-authors include Katsuya Kikuchi, E. Ohue, M. Tanabe, Katsuyoshi Washio and Naoya Watanabe and has published in prestigious journals such as IEEE Transactions on Electron Devices, Japanese Journal of Applied Physics and Physics of Fluids
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