Habib Hichri
About
Habib Hichri has authored 13 papers that have received a total of 356 indexed citations.
This includes 11 papers in Electrical and Electronic Engineering, 5 papers in Biomedical Engineering and 3 papers in Materials Chemistry. The topics of these papers are 3D IC and TSV technologies (6 papers), Integrated Circuits and Semiconductor Failure Analysis (3 papers) and Chalcogenide Semiconductor Thin Films (3 papers). Habib Hichri is often cited by papers focused on 3D IC and TSV technologies (6 papers), Integrated Circuits and Semiconductor Failure Analysis (3 papers) and Chalcogenide Semiconductor Thin Films (3 papers) and collaborates with scholars based in United States, Germany and France. Habib Hichri's co-authors include M. Marudachalam, Robert W. Birkmire, Julien Andrieu, J. M. Schultz and Klaus‐Dieter Lang and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Industrial & Engineering Chemistry Research
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