Harry K. Charles
About
Harry K. Charles has authored 44 papers that have received a total of 433 indexed citations.
This includes 33 papers in Electrical and Electronic Engineering, 7 papers in Materials Chemistry and 6 papers in Biomedical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (14 papers), 3D IC and TSV technologies (7 papers) and Advanced MEMS and NEMS Technologies (5 papers). Harry K. Charles is often cited by papers focused on Electronic Packaging and Soldering Technologies (14 papers), 3D IC and TSV technologies (7 papers) and Advanced MEMS and NEMS Technologies (5 papers) and collaborates with scholars based in United States. Harry K. Charles's co-authors include Charles Feldman, R. C. Benson, R. I. Joseph, F. G. Satkiewicz and Bliss G. Carkhuff and has published in prestigious journals such as Physical Review Letters, Journal of Applied Physics and Magnetic Resonance in Medicine
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