Haruo Akahoshi
About
Haruo Akahoshi has authored 49 papers that have received a total of 1.0k indexed citations.
This includes 33 papers in Electrical and Electronic Engineering, 14 papers in Mechanical Engineering and 13 papers in Polymers and Plastics. The topics of these papers are Electronic Packaging and Soldering Technologies (18 papers), Copper Interconnects and Reliability (10 papers) and 3D IC and TSV technologies (9 papers). Haruo Akahoshi is often cited by papers focused on Electronic Packaging and Soldering Technologies (18 papers), Copper Interconnects and Reliability (10 papers) and 3D IC and TSV technologies (9 papers) and collaborates with scholars based in Japan, United States and United Kingdom. Haruo Akahoshi's co-authors include Jin Onuki, Shinobu Toshima, Mitsuru Ueda, Jun Nunoshige and Masahiro Chiba and has published in prestigious journals such as Journal of Applied Physics, The Journal of Physical Chemistry and Journal of The Electrochemical Society
In The Last Decade
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