Henri Seppänen
About
Henri Seppänen has authored 22 papers that have received a total of 150 indexed citations.
This includes 14 papers in Electrical and Electronic Engineering, 7 papers in Mechanical Engineering and 7 papers in Mechanics of Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (7 papers), 3D IC and TSV technologies (6 papers) and Advanced Measurement and Metrology Techniques (5 papers). Henri Seppänen is often cited by papers focused on Electronic Packaging and Soldering Technologies (7 papers), 3D IC and TSV technologies (6 papers) and Advanced Measurement and Metrology Techniques (5 papers) and collaborates with scholars based in Finland, Ukraine and Sweden. Henri Seppänen's co-authors include Edward Hæggström, M. Oinonen, S.K. Kiprich, P. Janhunen and Z. Radivojević and has published in prestigious journals such as Journal of Materials Science, Review of Scientific Instruments and Computational Materials Science
In The Last Decade
Explore authors with similar magnitude of impact
Top countries impacted by papers by Carlos Cabrera López Top countries impacted by papers by Youssef Chahir Top journals papers by Robert Nowicki are published in Top fields papers by Pooja Jain are about Top fields papers by Ladislav Főző are about Top authors papers by Daniel Balasubramanian are co-authored with Top authors papers by Francis Kanashiro Meneghetti are co-authored with Top journals papers by Rahul Gupta are published in