Henry Yang

5 papers and 8 indexed citations i.

Henry Yang has authored 5 papers that have received a total of 8 indexed citations. This includes 3 papers in Electrical and Electronic Engineering, 2 papers in Biomedical Engineering and 2 papers in Computational Mechanics. The topics of these papers are Electronic Packaging and Soldering Technologies (3 papers), 3D IC and TSV technologies (3 papers) and Chemical Mechanical Polishing in Microelectronics Manufacturing (2 papers). Henry Yang is often cited by papers focused on Electronic Packaging and Soldering Technologies (3 papers), 3D IC and TSV technologies (3 papers) and Chemical Mechanical Polishing in Microelectronics Manufacturing (2 papers) and collaborates with scholars based in Taiwan, United States and India. Henry Yang's co-authors include John H. Lau, David Kuo, Zhaoning Yu, Kyung Lee and Eric Kuah and has published in prestigious journals such as Journal of Vacuum Science & Technology B Nanotechnology and Microelectronics Materials Processing Measurement and Phenomena and Journal of Micro/Nanolithography MEMS and MOEMS