Hiroshi Nishikawa

496 papers and 8.1k indexed citations i.

About

Hiroshi Nishikawa has authored 496 papers that have received a total of 8.1k indexed citations. This includes 221 papers in Mechanical Engineering, 191 papers in Electrical and Electronic Engineering and 59 papers in Mechanics of Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (170 papers), 3D IC and TSV technologies (106 papers) and Aluminum Alloys Composites Properties (50 papers). Hiroshi Nishikawa is often cited by papers focused on Electronic Packaging and Soldering Technologies (170 papers), 3D IC and TSV technologies (106 papers) and Aluminum Alloys Composites Properties (50 papers) and collaborates with scholars based in Japan, United Kingdom and China. Hiroshi Nishikawa's co-authors include M. Kaneta, Tadashi Takemoto, Yu-An Shen, Satoshi Honjo and Isao Todoroki and has published in prestigious journals such as Journal of Applied Physics, PLoS ONE and Cancer Research.

In The Last Decade

Fields of papers published by Hiroshi Nishikawa

Since Specialization
EngineeringComputer SciencePhysics and AstronomyMathematicsEarth and Planetary SciencesEnergyEnvironmental ScienceMaterials ScienceChemical EngineeringChemistryAgricultural and Biological SciencesVeterinaryDecision SciencesArts and HumanitiesBusiness, Management and AccountingSocial SciencesPsychologyEconomics, Econometrics and FinanceHealth ProfessionsDentistryMedicineBiochemistry, Genetics and Molecular BiologyNeuroscienceNursingImmunology and MicrobiologyPharmacology, Toxicology and Pharmaceutics

Countries citing papers authored by Hiroshi Nishikawa

Since Specialization
Citations
Rankless by CCL
2025