H.K. Kim

11 papers and 294 indexed citations i.

H.K. Kim has authored 11 papers that have received a total of 294 indexed citations. This includes 7 papers in Mechanical Engineering, 4 papers in Electrical and Electronic Engineering and 4 papers in Materials Chemistry. The topics of these papers are Intermetallics and Advanced Alloy Properties (6 papers), High Temperature Alloys and Creep (4 papers) and Electronic Packaging and Soldering Technologies (3 papers). H.K. Kim is often cited by papers focused on Intermetallics and Advanced Alloy Properties (6 papers), High Temperature Alloys and Creep (4 papers) and Electronic Packaging and Soldering Technologies (3 papers) and collaborates with scholars based in United States, South Korea and Japan. H.K. Kim's co-authors include James C. Earthman, F.G. Shi, J. Wolfenstine, Enrique J. Lavernia and Robert McClelland and has published in prestigious journals such as Materials Science and Engineering A, Journal of materials research/Pratt's guide to venture capital sources and Materials Letters