Hoang‐Vu Nguyen
About
Hoang‐Vu Nguyen has authored 51 papers that have received a total of 275 indexed citations.
This includes 42 papers in Electrical and Electronic Engineering, 13 papers in Aerospace Engineering and 8 papers in Mechanical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (18 papers), Microwave Engineering and Waveguides (18 papers) and 3D IC and TSV technologies (12 papers). Hoang‐Vu Nguyen is often cited by papers focused on Electronic Packaging and Soldering Technologies (18 papers), Microwave Engineering and Waveguides (18 papers) and 3D IC and TSV technologies (12 papers) and collaborates with scholars based in Norway, Canada and France. Hoang‐Vu Nguyen's co-authors include Christophe Caloz, Knut E. Aasmundtveit, Samer Abielmona, Erik Andreassen and Helge Kristiansen and has published in prestigious journals such as IEEE Access, Journal of Applied Polymer Science and Electronics Letters
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