Hongbin Shi

29 papers and 281 indexed citations i.

Hongbin Shi has authored 29 papers that have received a total of 281 indexed citations. This includes 16 papers in Electrical and Electronic Engineering, 10 papers in Mechanics of Materials and 7 papers in Biomedical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (9 papers), 3D IC and TSV technologies (9 papers) and Advanced ceramic materials synthesis (5 papers). Hongbin Shi is often cited by papers focused on Electronic Packaging and Soldering Technologies (9 papers), 3D IC and TSV technologies (9 papers) and Advanced ceramic materials synthesis (5 papers) and collaborates with scholars based in China, Japan and Singapore. Hongbin Shi's co-authors include Qing Liu, Yabing Zhang, Toshitsugu Ueda and Min Tang and has published in prestigious journals such as Chemical Engineering Journal, Journal of the American Ceramic Society and Industrial & Engineering Chemistry Research