Hongtao Chen
About
Hongtao Chen has authored 167 papers that have received a total of 2.7k indexed citations.
This includes 94 papers in Electrical and Electronic Engineering, 56 papers in Mechanical Engineering and 38 papers in Materials Chemistry. The topics of these papers are Electronic Packaging and Soldering Technologies (48 papers), 3D IC and TSV technologies (30 papers) and Aluminum Alloys Composites Properties (25 papers). Hongtao Chen is often cited by papers focused on Electronic Packaging and Soldering Technologies (48 papers), 3D IC and TSV technologies (30 papers) and Aluminum Alloys Composites Properties (25 papers) and collaborates with scholars based in China, United States and Singapore. Hongtao Chen's co-authors include Mingyu Li, Ruiqiang Ji, Yonghui Tian, Yangyang Lu and Weiwei Zhu and has published in prestigious journals such as Proceedings of the National Academy of Sciences, Applied Physics Letters and Langmuir
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