How Tseng

55 papers and 1.2k indexed citations i.

How Tseng has authored 55 papers that have received a total of 1.2k indexed citations. This includes 16 papers in Electrical and Electronic Engineering, 9 papers in Molecular Biology and 9 papers in Surgery. The topics of these papers are Electronic Packaging and Soldering Technologies (15 papers), 3D IC and TSV technologies (11 papers) and Copper Interconnects and Reliability (7 papers). How Tseng is often cited by papers focused on Electronic Packaging and Soldering Technologies (15 papers), 3D IC and TSV technologies (11 papers) and Copper Interconnects and Reliability (7 papers) and collaborates with scholars based in Taiwan, India and Japan. How Tseng's co-authors include Cheng‐Yi Liu, Chih‐Hsiung Wu, Shih‐Han Hung, Yuan‐Soon Ho and Yu‐Hsiang Hsiao and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Biomaterials