Hsing‐Hua Tsai
About
Hsing‐Hua Tsai has authored 22 papers that have received a total of 317 indexed citations.
This includes 9 papers in Electrical and Electronic Engineering, 7 papers in Electronic, Optical and Magnetic Materials and 6 papers in Materials Chemistry. The topics of these papers are Electronic Packaging and Soldering Technologies (8 papers), Copper Interconnects and Reliability (7 papers) and Microstructure and mechanical properties (6 papers). Hsing‐Hua Tsai is often cited by papers focused on Electronic Packaging and Soldering Technologies (8 papers), Copper Interconnects and Reliability (7 papers) and Microstructure and mechanical properties (6 papers) and collaborates with scholars based in Taiwan, Belgium and Germany. Hsing‐Hua Tsai's co-authors include Tung‐Han Chuang, Jong‐Shyan Wang, Chih‐Chin Hsu, Tieh‐Cheng Fu and Yi-Ching Chen and has published in prestigious journals such as Scientific Reports, Medicine & Science in Sports & Exercise and Journal of Alloys and Compounds
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