Hua Ye
About
Hua Ye has authored 6 papers that have received a total of 318 indexed citations.
This includes 5 papers in Electrical and Electronic Engineering, 3 papers in Electronic, Optical and Magnetic Materials and 1 paper in Materials Chemistry. The topics of these papers are Electronic Packaging and Soldering Technologies (4 papers), Copper Interconnects and Reliability (3 papers) and Metal and Thin Film Mechanics (1 paper). Hua Ye is often cited by papers focused on Electronic Packaging and Soldering Technologies (4 papers), Copper Interconnects and Reliability (3 papers) and Metal and Thin Film Mechanics (1 paper) and collaborates with scholars based in United States, United Kingdom and China. Hua Ye's co-authors include Cemal Basaran, Minghui Lin, Douglas C. Hopkins, Jiale Li and Yaxing Ren and has published in prestigious journals such as Energy Conversion and Management, International Journal of Solids and Structures and Finite Elements in Analysis and Design
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