Huai Huang
About
Huai Huang has authored 40 papers that have received a total of 700 indexed citations.
This includes 28 papers in Electrical and Electronic Engineering, 21 papers in Electronic, Optical and Magnetic Materials and 11 papers in Mechanics of Materials. The topics of these papers are Copper Interconnects and Reliability (19 papers), Semiconductor materials and devices (17 papers) and Metal and Thin Film Mechanics (11 papers). Huai Huang is often cited by papers focused on Copper Interconnects and Reliability (19 papers), Semiconductor materials and devices (17 papers) and Metal and Thin Film Mechanics (11 papers) and collaborates with scholars based in United States, Taiwan and China. Huai Huang's co-authors include Paul S. Ho, Michael D. Goodner, Hualiang Shi, Mansour Moinpour and Nicholas A. Lanzillo and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Thin Solid Films
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