Hui Deng
About
Hui Deng has authored 115 papers that have received a total of 1.7k indexed citations.
This includes 76 papers in Biomedical Engineering, 61 papers in Materials Chemistry and 53 papers in Electrical and Electronic Engineering. The topics of these papers are Chemical Mechanical Polishing in Microelectronics Manufacturing (70 papers), Diamond and Carbon-based Materials Research (47 papers) and Metal and Thin Film Mechanics (21 papers). Hui Deng is often cited by papers focused on Chemical Mechanical Polishing in Microelectronics Manufacturing (70 papers), Diamond and Carbon-based Materials Research (47 papers) and Metal and Thin Film Mechanics (21 papers) and collaborates with scholars based in China, Japan and Singapore. Hui Deng's co-authors include Kazuya Yamamura, Katsuyoshi Endo, Xinquan Zhang and Linfeng Zhang and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Biochemistry
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