Hui‐Wang Cui
About
Hui‐Wang Cui has authored 56 papers that have received a total of 744 indexed citations.
This includes 40 papers in Polymers and Plastics, 20 papers in Biomedical Engineering and 19 papers in Electrical and Electronic Engineering. The topics of these papers are Polymer Nanocomposites and Properties (21 papers), Electronic Packaging and Soldering Technologies (14 papers) and Synthesis and properties of polymers (13 papers). Hui‐Wang Cui is often cited by papers focused on Polymer Nanocomposites and Properties (21 papers), Electronic Packaging and Soldering Technologies (14 papers) and Synthesis and properties of polymers (13 papers) and collaborates with scholars based in China, Japan and Taiwan. Hui‐Wang Cui's co-authors include Guanben Du, Hiroshi Uchida, Katsuaki Suganuma, Jinting Jiu and Shiao‐Wei Kuo and has published in prestigious journals such as RSC Advances, Nanotechnology and Nano Research
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