Hui‐Wang Cui
About
Hui‐Wang Cui has authored 56 papers that have received a total of 744 indexed citations.
This includes 40 papers in Polymers and Plastics, 20 papers in Biomedical Engineering and 19 papers in Electrical and Electronic Engineering. The topics of these papers are Polymer Nanocomposites and Properties (21 papers), Electronic Packaging and Soldering Technologies (14 papers) and Synthesis and properties of polymers (13 papers). Hui‐Wang Cui is often cited by papers focused on Polymer Nanocomposites and Properties (21 papers), Electronic Packaging and Soldering Technologies (14 papers) and Synthesis and properties of polymers (13 papers) and collaborates with scholars based in China, Japan and Taiwan. Hui‐Wang Cui's co-authors include Guanben Du, Hiroshi Uchida, Katsuaki Suganuma, Jinting Jiu and Shiao‐Wei Kuo and has published in prestigious journals such as RSC Advances, Nanotechnology and Nano Research
In The Last Decade
Explore authors with similar magnitude of impact
Top fields papers by Janet R. Reid are about Top journals papers by J. Czapski are published in Top countries impacted by papers by Yajun Chen Top fields papers by Chongwei Zhang are about Top fields papers by Tijani A. Apalara are about Top authors papers by Hiroki Yoshioka are co-authored with Top countries impacted by papers by Ezequiel Wolcan Top authors papers by E. Diane Johnson are co-authored with