Hwa-Teng Lee
About
Hwa-Teng Lee has authored 15 papers that have received a total of 627 indexed citations.
This includes 13 papers in Mechanical Engineering, 11 papers in Electrical and Electronic Engineering and 3 papers in Biomedical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (8 papers), Advanced Welding Techniques Analysis (4 papers) and Intermetallics and Advanced Alloy Properties (4 papers). Hwa-Teng Lee is often cited by papers focused on Electronic Packaging and Soldering Technologies (8 papers), Advanced Welding Techniques Analysis (4 papers) and Intermetallics and Advanced Alloy Properties (4 papers) and collaborates with scholars based in Taiwan and Germany. Hwa-Teng Lee's co-authors include Fu-Chuan Hsu, Edward W. Hsu, Po‐Wei Chen, Ming-Hung Chen and Joachim Mayer and has published in prestigious journals such as Materials Science and Engineering A, Journal of Materials Processing Technology and Composite Structures
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