Hyuck Mo Lee
About
Hyuck Mo Lee has authored 211 papers that have received a total of 8.0k indexed citations.
This includes 94 papers in Materials Chemistry, 93 papers in Electrical and Electronic Engineering and 73 papers in Mechanical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (47 papers), Intermetallics and Advanced Alloy Properties (31 papers) and Aluminum Alloy Microstructure Properties (26 papers). Hyuck Mo Lee is often cited by papers focused on Electronic Packaging and Soldering Technologies (47 papers), Intermetallics and Advanced Alloy Properties (31 papers) and Aluminum Alloy Microstructure Properties (26 papers) and collaborates with scholars based in South Korea, United States and Japan. Hyuck Mo Lee's co-authors include Hyun You Kim, Changsoo Lee, Sang Soo Han, Kihyun Shin and Sun-Kyoung Seo and has published in prestigious journals such as Journal of the American Chemical Society, The Journal of Chemical Physics and Nature Communications
In The Last Decade
Explore authors with similar magnitude of impact
Top journals papers by Jack Siemiatycki are published in Top authors papers by Urs O. Häfeli are co-authored with Top journals papers by C.J. Banks are published in Top fields papers by John S. Sampalis are about Top fields papers by Gan Zheng are about Top authors papers by Mian Zhou are co-authored with Top countries impacted by papers by Nikolas Kaltsoyannis Top journals papers by John A. White are published in