I. A. Blech

52 papers and 8.5k indexed citations i.

I. A. Blech has authored 52 papers that have received a total of 8.5k indexed citations. This includes 35 papers in Electrical and Electronic Engineering, 23 papers in Electronic, Optical and Magnetic Materials and 13 papers in Materials Chemistry. The topics of these papers are Copper Interconnects and Reliability (22 papers), Semiconductor materials and devices (14 papers) and Electronic Packaging and Soldering Technologies (8 papers). I. A. Blech is often cited by papers focused on Copper Interconnects and Reliability (22 papers), Semiconductor materials and devices (14 papers) and Electronic Packaging and Soldering Technologies (8 papers) and collaborates with scholars based in Israel, United States and France. I. A. Blech's co-authors include Eugene S. Meieran, Y. Komem, S. Suresh, M. Finot and B. L. Averbach and has published in prestigious journals such as Physical Review Letters, Applied Physics Letters and Journal of Applied Physics