I. Ames
About
I. Ames has authored 16 papers that have received a total of 591 indexed citations.
This includes 8 papers in Electrical and Electronic Engineering, 7 papers in Atomic and Molecular Physics, and Optics and 4 papers in Electronic, Optical and Magnetic Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (4 papers), Copper Interconnects and Reliability (4 papers) and Surface and Thin Film Phenomena (3 papers). I. Ames is often cited by papers focused on Electronic Packaging and Soldering Technologies (4 papers), Copper Interconnects and Reliability (4 papers) and Surface and Thin Film Phenomena (3 papers) and collaborates with scholars based in United States and Brazil. I. Ames's co-authors include F. M. d’Heurle, J. H. Greiner, Hisashi Seki, S. Basavaiah and Ronald L. Christensen and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Review of Scientific Instruments
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