I. Turlik

26 papers and 315 indexed citations i.

I. Turlik has authored 26 papers that have received a total of 315 indexed citations. This includes 24 papers in Electrical and Electronic Engineering, 6 papers in Mechanical Engineering and 3 papers in Atomic and Molecular Physics, and Optics. The topics of these papers are Electronic Packaging and Soldering Technologies (13 papers), 3D IC and TSV technologies (11 papers) and Silicon Carbide Semiconductor Technologies (6 papers). I. Turlik is often cited by papers focused on Electronic Packaging and Soldering Technologies (13 papers), 3D IC and TSV technologies (11 papers) and Silicon Carbide Semiconductor Technologies (6 papers) and collaborates with scholars based in United States, Israel and Poland. I. Turlik's co-authors include Lih‐Tyng Hwang, Arnold Reisman, Robert Darveaux, Deepak Kumar Nayak and K. Linga Murty and has published in prestigious journals such as Journal of The Electrochemical Society, JOM and Journal of Electronic Materials