J. Cl. Puippe

8 papers and 340 indexed citations i.

J. Cl. Puippe has authored 8 papers that have received a total of 340 indexed citations. This includes 7 papers in Electrical and Electronic Engineering, 2 papers in Materials Chemistry and 2 papers in Computational Mechanics. The topics of these papers are Electrodeposition and Electroless Coatings (6 papers), Copper Interconnects and Reliability (2 papers) and Electrochemical Analysis and Applications (2 papers). J. Cl. Puippe is often cited by papers focused on Electrodeposition and Electroless Coatings (6 papers), Copper Interconnects and Reliability (2 papers) and Electrochemical Analysis and Applications (2 papers) and collaborates with scholars based in Switzerland, Germany and Poland. J. Cl. Puippe's co-authors include N. Ibl, A. Michalski, R. J. von Gutfeld, H. Angerer and R. E. Acosta and has published in prestigious journals such as Journal of The Electrochemical Society, Journal of Applied Electrochemistry and Transactions of the IMF