J. Dechamp

20 papers and 264 indexed citations i.

J. Dechamp has authored 20 papers that have received a total of 264 indexed citations. This includes 15 papers in Electrical and Electronic Engineering, 11 papers in Biomedical Engineering and 6 papers in Materials Chemistry. The topics of these papers are 3D IC and TSV technologies (11 papers), Chemical Mechanical Polishing in Microelectronics Manufacturing (8 papers) and Electronic Packaging and Soldering Technologies (5 papers). J. Dechamp is often cited by papers focused on 3D IC and TSV technologies (11 papers), Chemical Mechanical Polishing in Microelectronics Manufacturing (8 papers) and Electronic Packaging and Soldering Technologies (5 papers) and collaborates with scholars based in France, Switzerland and Czechia. J. Dechamp's co-authors include Marc Zussy, L. Di Cioccio, A. Tauzin, L. Clavelier and C. Deguet and has published in prestigious journals such as Journal of Applied Physics, Journal of The Electrochemical Society and Electronics Letters