J. Glazer
About
J. Glazer has authored 18 papers that have received a total of 871 indexed citations.
This includes 10 papers in Mechanical Engineering, 7 papers in Electrical and Electronic Engineering and 4 papers in Materials Chemistry. The topics of these papers are Electronic Packaging and Soldering Technologies (7 papers), 3D IC and TSV technologies (5 papers) and Aluminum Alloys Composites Properties (4 papers). J. Glazer is often cited by papers focused on Electronic Packaging and Soldering Technologies (7 papers), 3D IC and TSV technologies (5 papers) and Aluminum Alloys Composites Properties (4 papers) and collaborates with scholars based in United States, Spain and Poland. J. Glazer's co-authors include J. W. Morris, J.W. Morris, W.V. Hassenzahl, D.R. Dietderich and I‐Wen Wu and has published in prestigious journals such as Applied Physics Letters, AIAA Journal and Journal of Food Engineering
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