J. Liu
About
J. Liu has authored 22 papers that have received a total of 287 indexed citations.
This includes 13 papers in Electrical and Electronic Engineering, 9 papers in Mechanical Engineering and 6 papers in Biomedical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (12 papers), 3D IC and TSV technologies (5 papers) and Advanced Sensor and Energy Harvesting Materials (3 papers). J. Liu is often cited by papers focused on Electronic Packaging and Soldering Technologies (12 papers), 3D IC and TSV technologies (5 papers) and Advanced Sensor and Energy Harvesting Materials (3 papers) and collaborates with scholars based in Sweden, China and United Kingdom. J. Liu's co-authors include Z. Lai, L. Arnberg, S. J. Savage, Yifeng Fu and M. Willander and has published in prestigious journals such as Materials Letters, Knowledge-Based Systems and Computational Materials Science
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