J. Maiz

20 papers and 657 indexed citations i.

J. Maiz has authored 20 papers that have received a total of 657 indexed citations. This includes 17 papers in Electrical and Electronic Engineering, 11 papers in Electronic, Optical and Magnetic Materials and 5 papers in Mechanics of Materials. The topics of these papers are Copper Interconnects and Reliability (11 papers), Semiconductor materials and devices (11 papers) and Electronic Packaging and Soldering Technologies (8 papers). J. Maiz is often cited by papers focused on Copper Interconnects and Reliability (11 papers), Semiconductor materials and devices (11 papers) and Electronic Packaging and Soldering Technologies (8 papers) and collaborates with scholars based in United States, Spain and Switzerland. J. Maiz's co-authors include T. Scherban, Arief Suriadi Budiman, Ralph Spolenak, Sangwoo Pae and William D. Nix and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Acta Materialia