J. Neirynck
About
J. Neirynck has authored 8 papers that have received a total of 110 indexed citations.
This includes 6 papers in Electrical and Electronic Engineering, 6 papers in Biomedical Engineering and 4 papers in Electronic, Optical and Magnetic Materials. The topics of these papers are Chemical Mechanical Polishing in Microelectronics Manufacturing (6 papers), Semiconductor materials and devices (5 papers) and Copper Interconnects and Reliability (4 papers). J. Neirynck is often cited by papers focused on Chemical Mechanical Polishing in Microelectronics Manufacturing (6 papers), Semiconductor materials and devices (5 papers) and Copper Interconnects and Reliability (4 papers) and collaborates with scholars based in United States. J. Neirynck's co-authors include R.J. Gutmann, S. P. Murarka, G.‐R. Yang, Yiping Zhao and Joseph M. Steigerwald and has published in prestigious journals such as Journal of The Electrochemical Society, Thin Solid Films and Journal of Electronic Materials
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