J. Nicolics
About
J. Nicolics has authored 78 papers that have received a total of 553 indexed citations.
This includes 54 papers in Electrical and Electronic Engineering, 23 papers in Mechanical Engineering and 23 papers in Mechanics of Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (20 papers), Adhesion, Friction, and Surface Interactions (10 papers) and GaN-based semiconductor devices and materials (9 papers). J. Nicolics is often cited by papers focused on Electronic Packaging and Soldering Technologies (20 papers), Adhesion, Friction, and Surface Interactions (10 papers) and GaN-based semiconductor devices and materials (9 papers) and collaborates with scholars based in Austria, United States and Germany. J. Nicolics's co-authors include Franz P. Wenzl, Paul Fulmek, H. Hauser, Paul Hartmann and Gregor Langer and has published in prestigious journals such as Journal of Applied Physics, Scientific Reports and International Journal of Heat and Mass Transfer
In The Last Decade
Explore authors with similar magnitude of impact
Top journals papers by V. S. Timóteo are published in Top authors papers by Yu. M. Konstantinov are co-authored with Top fields papers by José Carlos Arévalo‐Lorido are about Top fields papers by K. Oide are about Top journals papers by Joseph M Jacob are published in Top journals papers by Keinosuke Ishido are published in Top authors papers by Philippe Lalèyé are co-authored with Top journals papers by Yourui Huang are published in