J. Nicolics
About
J. Nicolics has authored 78 papers that have received a total of 553 indexed citations.
This includes 54 papers in Electrical and Electronic Engineering, 23 papers in Mechanical Engineering and 23 papers in Mechanics of Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (20 papers), Adhesion, Friction, and Surface Interactions (10 papers) and GaN-based semiconductor devices and materials (9 papers). J. Nicolics is often cited by papers focused on Electronic Packaging and Soldering Technologies (20 papers), Adhesion, Friction, and Surface Interactions (10 papers) and GaN-based semiconductor devices and materials (9 papers) and collaborates with scholars based in Austria, United States and Germany. J. Nicolics's co-authors include Franz P. Wenzl, Paul Fulmek, H. Hauser, Paul Hartmann and Gregor Langer and has published in prestigious journals such as Journal of Applied Physics, Scientific Reports and International Journal of Heat and Mass Transfer
In The Last Decade
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