J. R. Lloyd

98 papers and 2.2k indexed citations i.

J. R. Lloyd has authored 98 papers that have received a total of 2.2k indexed citations. This includes 87 papers in Electronic, Optical and Magnetic Materials, 86 papers in Electrical and Electronic Engineering and 20 papers in Mechanics of Materials. The topics of these papers are Copper Interconnects and Reliability (86 papers), Electronic Packaging and Soldering Technologies (59 papers) and Semiconductor materials and devices (46 papers). J. R. Lloyd is often cited by papers focused on Copper Interconnects and Reliability (86 papers), Electronic Packaging and Soldering Technologies (59 papers) and Semiconductor materials and devices (46 papers) and collaborates with scholars based in United States, Germany and Singapore. J. R. Lloyd's co-authors include E. Liniger, S. Nakahara, R. G. Filippi, J. J. Clement and T. M. Shaw and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Journal of The Electrochemical Society