J. Sitek

42 papers and 257 indexed citations i.

J. Sitek has authored 42 papers that have received a total of 257 indexed citations. This includes 34 papers in Electrical and Electronic Engineering, 19 papers in Mechanical Engineering and 10 papers in General Materials Science. The topics of these papers are Electronic Packaging and Soldering Technologies (30 papers), 3D IC and TSV technologies (14 papers) and Metallurgical and Alloy Processes (10 papers). J. Sitek is often cited by papers focused on Electronic Packaging and Soldering Technologies (30 papers), 3D IC and TSV technologies (14 papers) and Metallurgical and Alloy Processes (10 papers) and collaborates with scholars based in Poland, Japan and Slovenia. J. Sitek's co-authors include J. Pstruś, W. Gąsior, Z. Moser, Ryszard Kisiel and Małgorzata Jakubowska and has published in prestigious journals such as Microelectronics Reliability, Journal of Materials Engineering and Performance and Journal of Phase Equilibria and Diffusion