J. Van Olmen

20 papers and 246 indexed citations i.

J. Van Olmen has authored 20 papers that have received a total of 246 indexed citations. This includes 17 papers in Electrical and Electronic Engineering, 9 papers in Electronic, Optical and Magnetic Materials and 6 papers in Atomic and Molecular Physics, and Optics. The topics of these papers are Copper Interconnects and Reliability (9 papers), Electronic Packaging and Soldering Technologies (8 papers) and 3D IC and TSV technologies (7 papers). J. Van Olmen is often cited by papers focused on Copper Interconnects and Reliability (9 papers), Electronic Packaging and Soldering Technologies (8 papers) and 3D IC and TSV technologies (7 papers) and collaborates with scholars based in Belgium, The Netherlands and China. J. Van Olmen's co-authors include Youssef Travaly, Michele Stucchi, Guruprasad Katti, Wim Dehaene and W. De Ceuninck and has published in prestigious journals such as Sensors, IEEE Electron Device Letters and Microelectronic Engineering