J. Wakil

10 papers and 345 indexed citations i.

J. Wakil has authored 10 papers that have received a total of 345 indexed citations. This includes 9 papers in Electrical and Electronic Engineering, 3 papers in Mechanical Engineering and 2 papers in Materials Chemistry. The topics of these papers are Electronic Packaging and Soldering Technologies (6 papers), 3D IC and TSV technologies (6 papers) and Heat Transfer and Optimization (3 papers). J. Wakil is often cited by papers focused on Electronic Packaging and Soldering Technologies (6 papers), 3D IC and TSV technologies (6 papers) and Heat Transfer and Optimization (3 papers) and collaborates with scholars based in United States. J. Wakil's co-authors include E. G. Colgan, B. K. Furman, R. Polastre, Roger Schmidt and Shaochen Chen and has published in prestigious journals such as IEEE Journal of Solid-State Circuits, IBM Journal of Research and Development and Microelectronics Reliability