Jae B. Kwak

23 papers and 171 indexed citations i.

Jae B. Kwak has authored 23 papers that have received a total of 171 indexed citations. This includes 15 papers in Electrical and Electronic Engineering, 8 papers in Biomedical Engineering and 8 papers in Mechanics of Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (10 papers), 3D IC and TSV technologies (6 papers) and Advanced Sensor and Energy Harvesting Materials (3 papers). Jae B. Kwak is often cited by papers focused on Electronic Packaging and Soldering Technologies (10 papers), 3D IC and TSV technologies (6 papers) and Advanced Sensor and Energy Harvesting Materials (3 papers) and collaborates with scholars based in South Korea and United States. Jae B. Kwak's co-authors include Seungbae Park, Da Yu, Jiachen Gao, Changsoo Jang and Jeong‐Heon Lee and has published in prestigious journals such as Sensors, Materials and Ceramics International