Jae Pil Jung
About
Jae Pil Jung has authored 179 papers that have received a total of 2.0k indexed citations.
This includes 133 papers in Electrical and Electronic Engineering, 93 papers in Mechanical Engineering and 21 papers in Materials Chemistry. The topics of these papers are Electronic Packaging and Soldering Technologies (121 papers), 3D IC and TSV technologies (92 papers) and Advanced Welding Techniques Analysis (39 papers). Jae Pil Jung is often cited by papers focused on Electronic Packaging and Soldering Technologies (121 papers), 3D IC and TSV technologies (92 papers) and Advanced Welding Techniques Analysis (39 papers) and collaborates with scholars based in South Korea, Canada and Australia. Jae Pil Jung's co-authors include Ashutosh Sharma, Do-Hyun Jung, Santosh Kumar, Y. Zhou and M. Mayer and has published in prestigious journals such as Journal of Materials Science, Sensors and Journal of Alloys and Compounds
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